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New PCB design partner introduction - ValiTech

by: Sep 17,2018 4582 Views 0 Comments Posted in News

wireless IoT FPGA FDM DLP 3D print PCB design

Summary:       ValiTech is an engineering services company founded in 2015. The company with a global presence and oriented to provide solutions to Medical & Industrial start-ups and SMEs.

ValiTech is an engineering services company founded in 2015.  The company with a global presence and oriented to provide solutions to Medical & Industrial start-ups and SMEs.

Through the use of state-of-the-art engineering processes and a strong global partnership with a leading electronic OEMs we are committed to transforming ideas into disruptive, leading edge products and systems.

With combined 30 years of industry experience, the team has a vast embedded firmware and hardware knowledge focused to help customers in development of  Hi-Tech connected solutions. ValiTech uses this expertise to solve most challenging problems at every stage of development phase. Whether your project requires a complex Linux solution or a Realtime microcontroller, ValiTech has the right expertise you are looking for. The staff can work with your team directly to extend their resources or independently develop solutions based on your requirements.

They are an expert developer of embedded solutions for communication and industrial applications including; microprocessor modules and middleware packages for voice, video, device management and secure IoT systems. ValiTech has hardware expertise in all mainstream 32 and 64-bit embedded architectures and software developers with expertise in kernel, drivers, applications and system integration including mobile app and IoT frameworks.

 

ValiTech product development capabilities:

WIRELESS

· WiFi b/g/n/ac, Bluetooth Low Energy 4.0, LoRaWAN, Cellular GSM/GPRS/EDGE, Zigbee PRO (IEEE 802.15.4), MiWi (Microchip),Infrared protocols.

MOTHERBOARD

· Raspberry Pi B/B+/28/3, BeagleBoard xM/C4, Radxa Rock Pro/Lite, Arduino UNO/Mega 2560, STM32F4 DISCOVERY, Altera Cyclone IV,DEO-Nano Development Board.

PROCESSORS

· ARMv6, ARMv7, ARM Cortex-AB, ARM Cortex-A9.

INTERFACES

· DDR3, MIPI, SDIO, SPI, 12S, USB, UART, 12C, RS232, ModBus,RS485/RS422, CAN, CANOpen, 1 -wire, S/PDIF, ProfiNET.

VIDEO

· SONY IMX Exmor R/RS, OmniVision Omni BSI/BSl-2, GeoSemiconductors ISP GW41 OO/GW4200.

AUDIO

· Class-D amplifiers, DAC's PCM51OOA/PCM1792, USB audio Class 1.0, Embedded high quality audio system.

POWER

· Li-Ion/Li-Po battery chargers, Fuel gauge, AC/DC, DC/DC, Wireless charging based on Tl solutions.

PCB layout capabilities

· Multilayer PCB from 2 to over 24 layers

· Through hole and surface mount technologies

· Rigid, Flexible and Rigid-Flex

· High frequency lines, controlled impedance lines, differential pairs

· Microstrip, stripline, matched length traces, DDR, SATA, Ethernet, USB

· High Voltage, High Current, High Impedance

· Very High Density Interconnect

· Blind via, buried via, via in pad

· Switching Mode Power Supply

· High Voltage, High Current, High Impedance

· Leading edge Interference Detection tools and techniques

· Integration of wireless & cellular technologies: GSM/GPRS, UMTS/HSPA(+), CDMA, NB-IoT, RPMA, LTE Cat M1, LoRA


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